Tsinghua AI Association of International Students (TAIS) news roundup 25 January

TAIS
Jan 25, 2021
Photo by Jonas Lee on Unsplash
  • Huawei moves into smart vehicles as US sanctions stymie 5G and semiconductor ambitions. [South China Morning Post]
  • The scale of Shanghai’s AI and semiconductor industries will double in the next five years: government officials. [Shine.cn]
  • US leads world on artificial intelligence but China is catching up: study. [South China Morning Post/AFP]
  • AI fairness is an economic and social imperative. Here’s how to address it. [World Economic Forum]

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Compiled by Nico Gous (nicogous@gmail.com / nico.gous@yahoo.com)

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TAIS

Tsinghua AI Association of International Students @ Beijing, China