Tsinghua AI Association of International Students (TAIS) news roundup 21 January

Photo by Markus Spiske on Unsplash
  • Chinese capital Beijing sets sights on building ‘trillion yuan’ hi-tech manufacturing clusters. [South China Morning Post]
  • China to pump USD 1.6 trillion into tech infrastructure through 2025. [KrASIA]
  • China Mobile says it has 165 million 5G subscribers. [cnTechPost]
  • Top Patentees in China for 2020. [The National Law Review]

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TAIS

Tsinghua AI Association of International Students @ Beijing, China