Tsinghua AI Association of International Students (TAIS) news roundup 21 January
- Chinese capital Beijing sets sights on building ‘trillion yuan’ hi-tech manufacturing clusters. [South China Morning Post]
- China to pump USD 1.6 trillion into tech infrastructure through 2025. [KrASIA]
- China Mobile says it has 165 million 5G subscribers. [cnTechPost]
- Top Patentees in China for 2020. [The National Law Review]
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Compiled by Nico Gous (nicogous@gmail.com / nico.gous@yahoo.com)
