Tsinghua AI Association of International Students (TAIS) news roundup 1 February

TAIS
Feb 1, 2021
Photo by Paul Frenzel on Unsplash

Huawei, SMIC join forces in Sino-US chip war. [Asia Times]

Huami Technology says it will soon launch its third-gen wearable chip. [cnTechPost]

Samsung warns chip shortage could spread from cars to smartphones. [cnTechPost]

SMIC withdraws from the US OTC market. [cnTechPost]

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Compiled by Nico Gous (nico.gous@yahoo.com)

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TAIS

Tsinghua AI Association of International Students @ Beijing, China